English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Interflex: Challenges and solutions to fabricate a double-sided wiring layer for a "system in foil"
Details
Full
Export
Statistics
Options
2014
Conference Paper
Titel
Interflex: Challenges and solutions to fabricate a double-sided wiring layer for a "system in foil"
Author(s)
Yacoub-George, E.
Drost, A.
Hemmetzberger, D.
Bollmann, D.
Faul, R.
Bock, K.
Hauptwerk
Smart Systems Integration 2014
Konferenz
Smart Systems Integration Conference (SSI) 2014
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components 2014
Language
English
google-scholar
View Details
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT