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A novel fabrication technology for waferlevel vacuum packaged microscanning mirrors
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2007
Conference Paper
Title
A novel fabrication technology for waferlevel vacuum packaged microscanning mirrors
Author(s)
Oldsen, M.
Hofmann, U.
Quenzer, H.-J.
Wagner, B.
Mainwork
EPTC 2007, 9th Electronics Packaging Technology Conference. Vol.1
Conference
Electronics Packaging Technology Conference (EPTC) 2007
DOI
10.1109/EPTC.2007.4469809
Language
English
Fraunhofer-Institut für Siliziumtechnologie ISIT
