2010
Conference Paper
Title

Processing, materials, and integration of damascene and 3D interconnects: Preface

Author(s)
Flake, J.
Ritzdorf, T.
Koyangi, M.
Leonte, O.
Mathad, G.S.
Ramm, P.
Rathore, H.S.
Roozeboom, F.
Mainwork
Conference
Language
English