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Processing, materials, and integration of damascene and 3D interconnects: Preface
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2010
Conference Paper
Title
Processing, materials, and integration of damascene and 3D interconnects: Preface
Author(s)
Flake, J.
Ritzdorf, T.
Koyangi, M.
Leonte, O.
Mathad, G.S.
Ramm, P.
Rathore, H.S.
Roozeboom, F.
Mainwork
Processing, materials, and integration of damascene and 3D interconnects
Conference
Symposium Processing, Materials, and Integration of Damascene and 3D Interconnects 2010
Electrochemical Society (Meeting) 2010
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
