Patterned DBD pretreatment at ambient pressure for low temperature wafer bonding

Two new atmospheric-pressure plasma processes, Local Plasma Treatment (LPT) and Plasma Printing (PP), are described, which allow a localized dielectric barrier discharge (DBD) treatment at predefined areas of a semiconductor wafer. At LPT method an etched structure on the surface of the wafer defines the pattern for plasma activation, whereas the principle of PP is vice versa: the flat surface of a silicon wafer is locally treated with DBDs which are defined by a structured electrode.