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  4. High-resolution nondestructive evaluation at the center for materials diagnosis
 
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2004
Conference Paper
Title

High-resolution nondestructive evaluation at the center for materials diagnosis

Abstract
The paper will give a brief overview on techniques that have been developed or are in progress for high resolution characterization of materials at the Center for Materials Diagnostics, University of Dayton. Acoustic microscopy is used to characterize coating systems and localized defects like corrosion pits. Significantly higher resolution is provided by Ultrasonic force microscopy, which allows the imaging of elastic inhomogenities in materials for example, studying nano-grain structures in copper films and nano precipates in aluminum alloys. Several optical high-resolution techniques have been developed or are in progress. These include interferometric imaging of the response of acoustic MEMS transducers, imaging of acoustic wave structures and early detection of crack initiation. Microellipsometric and NSOM imaging techniques are in development for imaging of surface structures significantly smaller than the optical wavelength. White light interference microscopy is frequently used to characterize surface topography with nanometer resolution for example, to quantify fretting damage or stress fields in front of fractures.
Author(s)
Meyendorf, N.
Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren IZFP  
Sathish, S.
University of Dayton Research Institute
Druffner, C.
University of Dayton Research Institute
Blackshire, J.
University of Dayton Research Institute
Hoffmann, J.
University of Dayton Research Institute
Zhan, Q.
University of Dayton Research Institute
Andrews, R.
University of Dayton Research Institute
Mainwork
Testing, reliability, and application of micro- and nano-material systems II  
Conference
Conference "Testing, Reliability, and Application of Micro- and Nano-Material Systems" 2004  
Language
English
IZFP-D  
Keyword(s)
  • high resolution NDE

  • acoustic microscopy

  • Ultrasonic Force Microscopy (UFM)

  • interferometry

  • white light interference microscopy

  • micro-ellipsometry

  • coating

  • fatigue

  • microcrack

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