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In situ real-time x-ray quality assessment of BGA and uBGA connections during soldering
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2003
Conference Paper
Title
In situ real-time x-ray quality assessment of BGA and uBGA connections during soldering
Author(s)
Scholz, O.
Eisenbarth, M.
Hanke, R.
Bigl, T.
Schmitt, P.
Mainwork
Testing, reliability, and application of micro- and nano-material systems
Conference
Conference "Testing, Reliability, and Application of Micro- and Nano-Material Systems" 2003
Language
English
Fraunhofer-Institut für Integrierte Schaltungen IIS
