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  4. Temperature dependent Dielectric Characterization of Low Loss Thin Film Polymer up to sub-THz bands
 
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2024
Conference Paper
Title

Temperature dependent Dielectric Characterization of Low Loss Thin Film Polymer up to sub-THz bands

Abstract
In this work, the dielectric properties of thin film materials are extracted up to sub-THz bands. Fabry-Pérot open resonator is used to extract non-metallized dielectric properties from cured standalone 60 μm Ajinomoto Build-up Film® (ABF) up to 140 GHz. Microstrip fork-coupled resonators are used to extract dielectric properties of ABF after fabrication processes such as curing, lamination, metallization, and etching. The fork resonators are modeled, fabricated and measured on 60 μm ABF film. Very good correlation is obtained between measurement and simulation results. Third order resonators are used to extract material properties above 110 GHz. Temperature dependent dielectric properties were extracted at 28 GHz and 140 GHz. The extracted dielectric properties show stable performance over a large frequency range at temperatures up to at least 100 °C making it suitable material for wide range of applications.
Author(s)
Murugesan, Kavin Senthil
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Schneider, Jens
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Le, Thi Huyen
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Gerhold, Lutz
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Kaiser, Michael Philipp  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Köszegi, Julia-Marie
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Hichri, Habib
Oishi, Ryohei
Nakano, Reki
Ndip, Ivan  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Schneider-Ramelow, Martin  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Mainwork
IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Proceedings  
Conference
Electronic Components and Technology Conference 2024  
DOI
10.1109/ECTC51529.2024.00139
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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