Laser-assisted surface modification and structuring for microsystem technology

The tailoring of chemical, morphological, optical and mechnical properties of surfaces by using, laser radiation is described for microsystem technology. taking advantage of matching the processing variables to the material removal. material deposition and light attenuation for the given and/or required properties of the materials involved. Anisotropic structuring with large aspect ratios, processing of various materials, composites and multi-layer-systems, low temperature processing of polymers. and selective processing with high flexibility and selectivity are exemplarily reported. These methods allow surface modification by chemical processing techniques, removal of matter by thermal and non-thermal processes including evaporation and ablation. deposition of single and multilayer thin films. photo- resistless patterning by direct and indirect processing techniques and rnachining of geometrical and metallurgical structures on a length scale ranging from mm to nm.