The creep behaviour and microstructure of ultra small solder joints

The creep behavior of Sn-based solders undergoes a significant scaling effect. Therefore this paper compares creep data that was gained on bulky samples and on small solder joints. Optical microscopy techniques and SEM-microprobe analysis were used to examine the microstructural properties of the bulk specimens and real solder joints were after metallographic sectioning. The results of these microstructural analysis were related to the investigated mechanical properties of the solders.