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Ceramic wafer bonding for vertically integrated MEMS
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2014
Conference Paper
Title
Ceramic wafer bonding for vertically integrated MEMS
Author(s)
Wünsch, Dirk
Froemel, J.
Wiemer, Maik
Geßner, Thomas
Mainwork
11th International Wafer-Level Packaging Conference, IWLPC 2014. CD-ROM
Conference
International Wafer-Level Packaging Conference (IWLPC) 2014
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
