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Heterogeneous integration: The bridge between micro/nanoelectronics and application
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2007
Conference Paper
Title
Heterogeneous integration: The bridge between micro/nanoelectronics and application
Author(s)
Aschenbrenner, R.
Mainwork
7th International Conference on Electronics Packaging Technology 2006
Conference
International Conference on Electronics Packaging Technology (ICEPT) 2006
DOI
10.1109/ICEPT.2006.359669
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
