Effects of hydrogen bonding and cross-linking on thermal conductivity of amorphous epoxy network

The thermal conductivities of different epoxy resin formulations are investigated with two different measurement methods. Special attention is given to the concentration of H-atoms bonded to N- or O-atoms and the crosslink density. To investigate the influence of these variables independently, the stoichiometry of the resin formulation is varied. If the significant variables are separated a linear correlation can be observed with the thermal conductivity. A higher crosslink density and a higher concentration of H-atoms bonded to N- or O-atoms lead to a higher thermal conductivity. H-atoms bonded to O-atoms lead to a higher thermal conductivity then H-atoms bonded to N-atoms.