3D capacitive interconnections with mono- and Bi-directional capabilities

A wireless interconnection scheme based on capacitive coupling provides mono- and bi-directional transmission capabilities for 3D system integration. Chips are implemented in 0.13m CMOS and assembled face-to-face. RX-TX circuits are connected by 8×8m2 electrodes and this enables the vertical propagation of clock at 1.7GHz, a propagation delay of 420ps for general purpose signals and a throughput of more than 22Mb/s/m 2with 0.08pJ/b energy consumption.