Thermal laser separation and its applications

The novel Thermal Laser Separation (TLS) technology allows for kerf-free dicing of brittle materials by crack guiding through thermally induced mechanical stress. Several benefits like a zero kerf and a high edge quality make it a promising technology for special applications: dicing of silicon carbide (SiC) with feed rates up to 200 mm/s, resizing of silicon wafers and dicing through pn-junctions of silicon diodes.