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FE-analysis of leaded and lead-free solder joints under thermal fatigue loading
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2004
Book Article
Title
FE-analysis of leaded and lead-free solder joints under thermal fatigue loading
Author(s)
Dudek, R.
Walter, H.
Döring, R.
Michel, B.
Mainwork
The world of electronic packaging and system integration
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM