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Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
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2005
Conference Paper
Title
Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Author(s)
Röllig, M.
Dudek, R.
Wiese, S.
Wunderle, B.
Wolter, K.-J.
Michel, B.
Mainwork
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2005
Conference
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) 2005
DOI
10.1109/ESIME.2005.1502779
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
