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Zerstörungsfreie 3-dimensionale Defektlokalisierung an System-in-Packages (SIP) mittels Lock-in Thermographie
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2013
Doctoral Thesis
Title
Zerstörungsfreie 3-dimensionale Defektlokalisierung an System-in-Packages (SIP) mittels Lock-in Thermographie
Thesis Note
Halle, Univ., Diss., 2012
Author(s)
Schmidt, C.
Person Involved
Wehrspohn, R.B.
Boit, C.
Publishing Place
Halle
Language
German
Fraunhofer-Institut für Werkstoffmechanik IWM