Time Domain Modeling of Interconnected Integrated Circuits Based on Black Box Approach and Model Order Reduction for Signal Integrity Applications

This paper presents black box based abstract ap proach to the modeling of the whole ( driver, interconnect, re ceiver) signal path in high density packaged (HDP) integrated circuits (IC). As interconnected ICs constitute very complex systems, they require effective representation for system level simulations. Mathematical description of !Cs and interconnects can deliver fast and compact time domain macromodels that are easy to implement in Spice. In this article simulation results of several black box !Cs macromodels connected to model order reduced interconnect description are presented. These time domain macromodels allow for numerically efficient anal ysis and simulation of the signal behavior in interconnected, modern !Cs.