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  4. Characterization of printed electronics
 
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2017
Conference Paper
Title

Characterization of printed electronics

Abstract
The presentation includes several possibilities to characterize printed electronics. In the field of production and research, it is important to know whether the quality of the layers remains unchanged and what kind of properties the layers or dispersions possess. The presentation is structured in two sections "characterization of Dispersion" and "characterization of layer"". The first section presents the characterization methods that the properties of the dispersions investigate (see below). - Particle size and particle size distribution - Rheology - Viscosity - wetting behavior - adhesion on the substrate The second section presents the characterization methods that the properties of the applied layers describe (see below). - Layer thickness - laser scanning microscope - Adhesion - Electrical characterization - Two-terminal-sensing - Four-terminal sensing - Four-point-probes Transparency - UV-VIS Spectrophotometer
Author(s)
Lee, Daniel
Fraunhofer-Institut für Produktionstechnik und Automatisierung IPA  
Mainwork
Industry 4.0 - Cyber-Physical Systems  
Conference
Seminar "Industry 4.0 - Cyber-Physical Systems" 2017  
Language
English
Fraunhofer-Institut für Produktionstechnik und Automatisierung IPA  
Keyword(s)
  • Industrie 4.0

  • functional material

  • Cyber-Physisches System (CPS)

  • printed electronics

  • Nanomaterial

  • dispersion

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