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  4. Three-Dimensional Integration
 
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2012
Book Article
Title

Three-Dimensional Integration

Author(s)
Garrou, P.
Lu, J.J.-Q.
Ramm, P.
Mainwork
Handbook of wafer bonding  
DOI
10.1002/9783527644223.ch15
Language
English
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
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