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Microscopic deformation field measurement supporting FEA based reliability analysis in electronic packaging
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1999
Conference Paper
Title
Microscopic deformation field measurement supporting FEA based reliability analysis in electronic packaging
Author(s)
Vogel, D.
Gollhardt, A.
Kühnert, R.
Auersperg, J.
Michel, B.
Mainwork
Workshop on Polymeric Materials for Microelectronics and Photonics Applications 1999: Mechanics, Physics, Reliability, Processing. Proceedings
Conference
Workshop on Polymeric Materials for Microelectronics and Photonics Applications 1999
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
