Manufacturing for Reliability of Panel-Level Fan-out Packages

In this chapter, the manufacture for reliability of Fan-out Packages is discussed from a perspective of the panel-level packaging process. During processing, the material interfaces are formed and in the case of the epoxy molding compound, properties are established. The process is described in detail with a focus on the challenges which arise or intensify on large area panels. The supposed origins of warpage die shift and flow marks are described. An appraisal of processing impacts to reliability consideration with respect to these challenges is discussed along with a classification of recent publications on the topic. An outlook is given on future needs of investigations to move toward digital twins in manufacturing and reliability in Fan-out Panel-Level Packaging.