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  4. Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems
 
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2006
Conference Paper
Title

Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems

Abstract
This paper describes the application of a new method to verify the pressure and sealing of cavities in micromechanical components. The new method makes it possible to measure the pressure and the sealing (through measuring the pressure over time) of smallest gasvolumes with the monitoring of the quality factor of integrated micromechanical resonant structures. An example is used that shows the complete process of fabricating such micro mechanical resonant structures to evaluate a bonded structure.
Author(s)
Frömel, J.
Billep, D.
Gessner, T.
Wiemer, M.
Mainwork
Wafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004. Special Issue  
Conference
Wafer-Bonding Workshop for MEMS Technologies 2004  
DOI
10.1007/s00542-005-0032-8
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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