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  4. Managing the return-currents of signal vias in organic and silicon substrates
 
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2010
Conference Paper
Title

Managing the return-currents of signal vias in organic and silicon substrates

Abstract
In this work, some of the EMR problems which occur when the return-currents of vias in organic and silicon substrates are not controlled are examined. Via configurations and layer stack-ups used to properly manage these return-currents are then proposed.
Author(s)
Ndip, I.
Löbicke, K.
Bierwirth, M.
Tschoban, C.
Curran, B.
Erxleben, R.
Ohnimus, F.
Maaß, U.
Fotheringham, G.
Guttowski, S.
Reichl, H.
Mainwork
Smart systems integration 2010. 4th European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components. CD-ROM  
Conference
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components 2010  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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