Thermally optimised millimeter wave package on an LTCC ceramic board

The efficiency of finite element modeling (FEM) submodeling for thermal via arrangement was explored. Two assembly technologies, soldering and gluing, were studied in order the characterize the thermal resistance of the different layers between die and case. The comparison of calculated and measured surface temperatures allowed for the influence of inaccurate parameters in the FE model to be diminished and leads to a more realistic FE modeling of prospective electronic assemblies.