English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
a46Parametric FE-approach to flip chip reliability under various loading situations
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
2002
Conference Paper
Title
a46Parametric FE-approach to flip chip reliability under various loading situations
Author(s)
Wunderle, B.
Nüchter, W.
Schubert, A.
Michel, B.
Reichl, H.
Mainwork
3rd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics, ESIME 2002. Proceedings
Conference
International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE) 2002
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
