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a46Parametric FE-approach to flip chip reliability under various loading situations
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2002
Conference Paper
Title
a46Parametric FE-approach to flip chip reliability under various loading situations
Author(s)
Wunderle, B.
Nüchter, W.
Schubert, A.
Michel, B.
Reichl, H.
Mainwork
3rd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics, ESIME 2002. Proceedings
Conference
International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE) 2002
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
