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  4. Reliability investigation on SiC BJT power module
 
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2016
Conference Paper
Title

Reliability investigation on SiC BJT power module

Abstract
In this paper reliability investigation results for a power module fully based on silicon carbide (SiC) devices are presented. The module comprises four SiC bipolar junction transistors (BJT) and four SiC diodes in half-bridge configuration and is part of a newly developed 3-phase inverter for construction vehicles as well as for passenger car applications. The reliability investigations include electro-thermal and thermo-mechanical finite element simulations as well as power cycling tests with subsequent failure analyses. Furthermore, a double-sided cooling approach for the SiC BJT power module will be described and its thermal performance compared to the single-sided cooling version.
Author(s)
Otto, Alexander  
Kaulfersch, Eberhard
Frankeser, S.
Brinkfeldt, K.
Zschieschang, O.
Rzepka, Sven  
Mainwork
PCIM Europe 2016. Proceedings. CD-ROM  
Conference
PCIM Europe 2016  
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
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