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  4. A 94 GHz single-chip FMCW radar module for commercial sensor applications
 
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2002
Conference Paper
Title

A 94 GHz single-chip FMCW radar module for commercial sensor applications

Other Title
Ein monolithisch integriertes 94 GHz FMCW Radar Modul für den Einsatz in kommerziellen Sensor Anwendungen
Abstract
A single-chip 94 GHz frequency modulated continuous wave (FMCW) radar module has been developed for high resolution sensoring under adverse conditions and environments. The monolithic microwave integrated circuit (MMIC) includes a varactor tuned VCO with injection port, very compact transmit and receive amplifiers and a single-ended resistive mixer. To enable bidirectional operation of a single transmit-receive antenna a combination of a Wilkinson divider and a Lange coupler was integrated. The circuit features coplanar technology and cascode HEMTs for compact size and low cost. These techniques result in a particularly small over-all chip-size of only 2 x 3 mm2. The packaged 94 GHz FMCW radar sensor achieved a tuning range of 6 GHz, an output power of 1mW and a conversion loss of 5 dB. The RF performance of the radar module was successfully verified by real-time monitoring the time flow of a gas-assisted injection molding process.
Author(s)
Tessmann, Axel  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Kudszus, S.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Feltgen, T.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Riessle, Markus  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Sklarczyk, C.
Haydl, W.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Mainwork
IEEE MTT-S International Microwave Symposium digest 2002. Vol.3  
Conference
International Microwave Symposium (IMS) 2002  
DOI
10.1109/MWSYM.2002.1012223
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • FMCW-Radar

  • MMIC

  • W-Band

  • GaAs

  • coplanar waveguide

  • koplanare Wellenleiter

  • injection molding

  • Spritzgießen

  • flip-chip packaging

  • Flip-chip Aufbautechnik

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