On the Numerical Analysis of Microwave Processes in Microsystems Packaging Applications

Electronics packaging is the process of attaching a semiconducor device to a supporting structure, such as a printed circuit board, and provision of protective materials or sturctures to the semiconductor device to enhance performance and reliability. Modern packaging technologies use polymeric materials in order to provide thermomechanical support for the device and a hermetic barrier encompassing the semiconductor. Thermosetting materials are typically used and require heat to induce or expediate the curing process. Recent studies have focused on using microwave technology to enhace the polymer cure process. Due to the complex coupled nature of the problem and the difficulty in assessing microwave curing experimentally, a numerical approach to process analysis has been adopted. This study outlines the numerical approach adopted to analyse the critical process parameters during microwave curing of microsystems packaging materials.