Thermal management in high-density power converters

This paper gives an overview of basic principles of the thermal management in high-density power converters. Methods for heat removal on a device and circuit board level are discussed. New packaging technologies for discrete power semiconductors as well as multifunctional board integration techniques are included. A view is given on future 3D integration techniques that take into account the poor thermal conductivity especially of the passive component materials. With these techniques much higher power densities are possible. Some examples of prototype systems are presented, together with the achieved technical data.