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  4. SIMOX and wafer bonding, combination of competitors complements one another
 
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1993
Conference Paper
Title

SIMOX and wafer bonding, combination of competitors complements one another

Author(s)
Gassel, H.
Vogt, H.
Mainwork
Electrochemical Society Meeting '93. Extended Abstracts  
Conference
Electrochemical Society (Meeting) 1993  
Language
English
Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS  
Keyword(s)
  • Ätzen

  • Ätzgeschwindigkeit

  • buried etch stop

  • etch rate

  • etching

  • silicon-on-insulator

  • SIMOX

  • wafer bonding

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