English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Artikel
Innovative Material Diagnostics Methods for Through Silicon Via 266 Technologies
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
2015
Book Article
Title
Innovative Material Diagnostics Methods for Through Silicon Via 266 Technologies
Author(s)
Altmann, F.
Brand, S.
Höche, T.
Krause, M.
Petzold, M
Mainwork
Microelectronic Packaging in the 21st Century
Language
English
IWM-H