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2006
Conference Paper
Title

Advanced packages with buried dies

Title Supplement
Design support by means of FE analysis and deformation measurement in micro scale
Author(s)
Sommer, J.-P.
Döring, R.
Dost, M.
Michel, B.
Mainwork
EMPS 2006 - 4th European Microelectronics and Packaging Symposium with Table-Top Exhibition. Proceedings  
Conference
European Microelectronics and Packaging Symposium with Table-Top Exhibition 2006  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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