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Advanced packages with buried dies
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2006
Conference Paper
Title
Advanced packages with buried dies
Title Supplement
Design support by means of FE analysis and deformation measurement in micro scale
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Author(s)
Sommer, J.-P.
Döring, R.
Dost, M.
Michel, B.
Mainwork
EMPS 2006 - 4th European Microelectronics and Packaging Symposium with Table-Top Exhibition. Proceedings
Conference
European Microelectronics and Packaging Symposium with Table-Top Exhibition 2006
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM