2015
Doctoral Thesis
Title

New assembly and packaging technologies for high-power and high-temperature GaN and SiC devices

Thesis Note
Freiburg/Brsg., Univ., Diss., 2015
Author(s)
Bajwa, A.A.
Person Involved
Wilde, J.
Ambacher, O.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Publishing Place
Freiburg/Brsg.
Language
English