BiCMOS Integrated Temperature Sensor for Thermal Evaluation of Fan-out Wafer-level Packaging (FOWLP) including Hot Spot Analysis

A SiGe BiCMOS thermal chip for thermal package characterization is developed and demonstrated together with a chip-first, face-down FOWLP technology. The dedicated BiCMOS thermal chip enables a spatially resolved heat generation and temperature characterization to analyze the effects of uniform heat generation as well as hot spots within integrated circuits and package technologies. The BiCMOS thermal chip can be applied for various wafer-level package technology providing an in-depth analysis of the thermal management.