Advanced packages are necessary to cope with the requirements of 5G and radar technologies with 60 GHz and beyond. For proper RF design with rising package technology requirements demands for usage of predefined structures with predefined layout elements, manufactured and measured elements. This paper deals with an approach to have such elements available to build advanced types of packages in shorter time compared to classical approaches. The approach is a general approach but it is demonstrated with an advanced two-level package-on-package technology with a leading-edge IC technology. It is also used explain the build-up of a construction kit of RF-blocks from the design phase of test structures up to measurement of such structures, qualification and model building. From the test structure more general structures can be derived and used in the design of future 5G applications. This enables better time-to-market, reduces cost and provides higher design validation in terms of first time right.