2025
Presentation
Title

Key Mechanisms of Laser-Based Splitting and Dicing of 4H-SiC Wafers

Title Supplement
Presentation held at 22nd International Conference on Silicon Carbide and Related Materials 2025, Busan, South Korea, 15.09.2025-19.09.2025
Author(s)
Mir, Hanan
Fraunhofer-Institut für Solare Energiesysteme ISE  
Boulogiannis, Grigorios
Fraunhofer-Institut für Solare Energiesysteme ISE  
Schillinger-Engel, Kai
Fraunhofer-Institut für Werkstoffmechanik IWM  
Meyer, Fabian
Fraunhofer-Institut für Solare Energiesysteme ISE  
Conference
File(s)
Rights
Use according to copyright law
DOI
Language
English