Sequential combination of micro-milling and laser structuring for manufacturing of complex micro-fluidic structures
Prozesskombination von Mikrofräs- und Laserstrukturierung für die Bearbeitung komplexer Mikrofluidstrukturen
This paper deals with the combination of micro milling and laser micro structuring for processing hot embossing dies for microfluidic applications. This strategy permits the advantages of each process technology to be exploited in order to achieve a cost and time efficient process and also to process forms and structures which cannot be manufactured with the single processes micro milling and laser micro structuring. Basic requirements are a high-precision positioning of the single process areas and also a good machining of the parts and structures with the manufacturing processes micro milling and laser micro structuring. The intersections between the different processing areas present a challenge for this process technology.