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  4. A 75-305-GHz Power Amplifier MMIC with 10-14.9-dBm Pout in a 35-nm InGaAs mHEMT Technology
 
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2021
Journal Article
Title

A 75-305-GHz Power Amplifier MMIC with 10-14.9-dBm Pout in a 35-nm InGaAs mHEMT Technology

Abstract
The demonstration of a 75-305-GHz power amplifier (PA) monolithic microwave integrated circuit (MMIC) is presented in this letter. The PA is based on an eight-cell traveling-wave unit amplifier (UA). Each cell contains an RF cascode with two two-finger transistors with a gate width of 20 mm each. In the output stage, a balanced configuration combines two UAs with Lange couplers. In front, a third UA is used as a driver amplifier. The PA MMIC is fabricated in a 35-nm gate-length metamorphic high-electron-mobility transistor technology. From 75 to 305 GHz, the PA yields a minimum output power of 10 dBm with an average value of 12.8 dBm. At 200 GHz, a peak output power and PAE of 14.9 dBm and 6.6% is achieved, respectively. To the best of the authors' knowledge, this is the first PA MMIC with an octave-bandwidth that provides an output power of 10 dBm at 300 GHz.
Author(s)
Thome, Fabian  orcid-logo
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Leuther, Arnulf  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Journal
IEEE microwave and wireless components letters  
Open Access
DOI
10.1109/LMWC.2021.3058101
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • distributed amplifier (DA)

  • high-electron-mobility transistor (HEMT)

  • Lange coupler

  • metamorphic HEMT (mHEMT)

  • milimeter-wave (mmW)

  • monolithic microwave integrated circuit (MMIC)

  • power amplifier (PA)

  • thin-film microstrip transmission line (TF-MSL)

  • traveling-wave amplifier (TWA)

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