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Overview of wafer bonding and characterization of the bonded interface
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2014
Book Article
Title
Overview of wafer bonding and characterization of the bonded interface
Author(s)
Vogel, Klaus
Haubold, M.
Wiemer, Maik
Geßner, Thomas
Mainwork
Smart systems integration for micro- and nanotechnologies
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
