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  4. Aluminum-germanium wafer bonding of (AlGaIn)N thin film light-emitting diodes
 
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2011
Conference Paper
Title

Aluminum-germanium wafer bonding of (AlGaIn)N thin film light-emitting diodes

Title Supplement
Abstract
Author(s)
Gossler, C.
Kunzer, M.
Baum, Mario  
Wiemer, Maik  
Moser, R.
Passow, T.
Koehler, K.
Schwarz, U.T.
Wagner, J.
Mainwork
WaferBond 2011, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. Book of Abstracts  
Conference
Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) 2011  
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
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