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  4. Machine Learning Lifecycle Management Using Dataspaces for Optimized Machine Parameterization in Recycled Plastic Packaging
 
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2025
Conference Paper
Title

Machine Learning Lifecycle Management Using Dataspaces for Optimized Machine Parameterization in Recycled Plastic Packaging

Abstract
The increasing demand for sustainable plastic packaging has led to a growing interest in optimizing machine parameters for processing recycled plastics. This paper presents a dataspace-driven demonstrator for machine learning (ML) lifecycle management in machine parameter optimization for thermoforming processes. Our setup involves three key dataspace participants: a thermoforming machine manufacturer, a plastic packaging producer, and an ML service provider. By leveraging dataspaces and a microservice-based architecture, we enable secure data exchange while addressing industry concerns about proprietary data sharing. The implemented demonstrator integrates the ML lifecycle in the form of microservices, facilitating efficient training, deployment, and monitoring of ML models. Our demonstrator highlights the potential of dataspaces in enabling collaborative, data-driven optimization of machine parameters while maintaining data sovereignty.
Author(s)
Nasuta, Alexander
Rheinisch-Westfälische Technische Hochschule Aachen
Olbrych, Sylwia
Rheinisch-Westfälische Technische Hochschule Aachen
Quix, Christoph  
Fraunhofer-Institut für Angewandte Informationstechnik FIT  
Kaluza, Tim
Fraunhofer-Institut für Verfahrenstechnik und Verpackung IVV  
Schaller, Florian
Fraunhofer-Institut für Verfahrenstechnik und Verpackung IVV  
Steinert, Sabrina
Apheris AI
Zhou, Hans Aoyang
Rheinisch-Westfälische Technische Hochschule Aachen
Abdelrazaq, Anas
Rheinisch-Westfälische Technische Hochschule Aachen
Schmitt, Robert  
RWTH Aachen  
Mainwork
Intelligent Data Engineering and Automated Learning – IDEAL 2025  
Conference
International Conference on Intelligent Data Engineering and Automated Learning 2025  
DOI
10.1007/978-3-032-10486-1_11
Language
English
Fraunhofer-Institut für Angewandte Informationstechnik FIT  
Fraunhofer-Institut für Verfahrenstechnik und Verpackung IVV  
Keyword(s)
  • Dataspace

  • Gaia-X

  • Industrial Internet of Things

  • Machine Learning Lifecycle Management

  • Recycled Plastic Packaging

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