A new method for local strain field analysis near cracks in micro- and nanotechnology applications

The paper presents a new reliability approach based on local stress and deformation analysis by means of digital image correlation methods. The so-called nanoDAC- (deformation analysis by correlation technique) method is applied in connection with creep and fatigue crack evaluation concepts. This will lead to improved lifetime estimations of microsolder joints in electronic packaging and in MEMS and NEMS interconnection technologies as well.