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  4. Characterization of a Flexible Polymer-Based Substrate Material for RF Applications
 
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January 22, 2023
Conference Paper
Title

Characterization of a Flexible Polymer-Based Substrate Material for RF Applications

Abstract
While mechanically flexible substrate materials are widely used in electronics, especially for interconnects between moving system parts or medical sensors to be mounted onto the body surface, they are barely used in micro- and millimeter-wave applications. In this work, the design permittivity of a low-cost, polymer-based flexible substrate is extracted by measurement and the insertion losses of typical line structures are measured. Moreover, application examples of a patch antenna and a bendable substrate-integrated waveguide are presented.
Author(s)
Michler, Fabian
Kolpak, Jasmin
Scheiner, Benedict
Weigel, Robert
Hagelauer, Amelie  
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
Mainwork
IEEE Radio and Wireless Symposium, RWS 2023  
Conference
Radio and Wireless Symposium 2023  
Radio and Wireless Week 2023  
DOI
10.1109/RWS55624.2023.10046309
Language
English
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
Keyword(s)
  • Antenna measurements

  • Wireless communication

  • Radio frequency

  • Wireless sensor networks

  • Permittivity measurement

  • Surface waves

  • Sensor systems and applications

  • material characterization

  • flexible electronics

  • microwave measurements

  • permittivity

  • printed circuit boards

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