Joining procedures for a high precision assembly of micro-optical systems

Joining of micro-optical systems is an important step during the manufacturing process, especially when miniaturisation, high precision, long term stability and an automatic production are required. This paper is focused on the parameters of different joining technologies in the context of precision handling, alignment and packaging of micro-optical components. A newly developed soldering technique, based on the application of lead and flux free solder layers and preforms, will be described in detail for laser module applications that are assembled on ceramic printed circuit board platforms with embedded mounting structures.