Hermetic packaging concept for laser diodes on wafer level

While discrete laser diodes may be evacuated and sealed on single die level using small metal TO packages like TO housings, it is obvious that high volume production for mobile applications requires a much more economical and small factor solution for the realization of transparent optical packages. We present here a solution that realizes glass packages with vertical emission window for laser diodes on 8" silicon substrates. The new process uses a high temperature glass forming process with a combination of two different glasses each having different melting points.