Parallel approach to MEMS and micro-optics interferometric testing
The paper presents the novel approach to an interferometric, quantitative, massive parallel inspection of MicroElectroMechanicalSystems (MEMS), MicroOptoElectroMechanical Systems (MOEMS) and microoptics arrays. The basic idea is to adapt a micro-optical probing wafer to the M(O)EMS wafer under test. The probing wafer is exchangeable and contains one of the micro-optical interferometer arrays based on: (1) a low coherent interferometer array based on a Mirau configuration or (2) a laser interferometer array based on a Twyman-Green configuration. The optical, mechanical, and electro-optical design of the system and data analysis concept based on this approach is presented. The interferometer arrays are developed and integrated at a standard test station for micro-fabrication together with the illumination and imaging modules and special mechanics which includes scanning and electrostatic excitation systems. The smart-pixel approach is applied for massive parallel electro- optical detection and data reduction. The first results of functional tests of the system are presented. The concept is discussed in reference to the future M(O)EMS and microoptics manufacturers needs and requirements.