Finite Element Analysis: A Tool for Investigation of Sharpness Changes in Automotive Cameras

This paper investigates the most common sources for Change in Sharpness (CIS) of an automotive camera system. Deformation related to mismatches in Coefficient of Thermal Expansion (CTE) and creep in the BGA-Solder interconnect has been identified as most important source of CIS. This paper focuses on the development of a Zero-Hour model for a later planned extensive thermal cycling simulation investigating CIS over system lifetime. The Model is based on a simplified camera module, simulated in the thermal operations window of the system. The Zero-Hour model includes the curing process of the adhesive, which accounts for residual deformation in the components during assembly. Using this as a baseline, temperature cycling was simulated to investigate creep in the solder interconnects.