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1998
Journal Article
Title

Schichten charakterisieren

Abstract
Nondestructive and Contactless Characterization of Layers: Dielectric materials and materials with low conductivity consisting of multiple layers as well as coatings can be characterized nondestructively and contactless by means of microwaves in transmission and reflection. Measuring quantities which can be determined are e.g. layer thciness, permittivity, porosity or moisture. The thickness of the dielectric layers should not be much smaller than one wave length. However, in some dases semiconducting and metaalic layers can be characterized if the thickness is much smaller than the wave length. In increasing extent low-priced and highly integrated microwave components are available for that purpose.
Author(s)
Sklarczyk, C.
Netzelmann, U.
Ehlen, F.
Journal
Materialprüfung  
Language
German
Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren IZFP  
Keyword(s)
  • berührungslos

  • contactless

  • layer

  • microwave

  • Mikrowelle

  • Mikrowellenverfahren

  • Schicht

  • zerstörungsfreie Prüfung

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