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Conformance of ECD wafer bumping to future demands on CSP, 3D integration and MEMS
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2006
Conference Paper
Title
Conformance of ECD wafer bumping to future demands on CSP, 3D integration and MEMS
Author(s)
Dietrich, L.
Toepper, M.
Ehrmann, O.
Reichl, H.
Mainwork
ECTC 2006, the 56th Electronic Components and Technology Conference. Proceedings. CD-ROM
Conference
Electronic Components and Technology Conference (ECTC) 2006
DOI
10.1109/ECTC.2006.1645783
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
